PRODUCT DISPLAY
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16L 2mm 0.5oz Back-drilling Green ENIG
Min track/gap 3mil/3mil
Min hole: 0.15mm
Board thickness: 2.mm
Surface : ENIG
Inner layer:0.5oz
Outer layer:1oz
Material：FR4 IT-180A Tg:180
Specialty: 16L 1oz,back-drilling¥ 0.00立即购买
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24L 2.4mm 1oz EM890K Matte black ENIG
24L 2.4mm 1oz EM890K Matte black ENIG
24L 2.4mm 1oz Matte black ENIG
Min track/gap:3mil/3mil
Min hole: 0.25mm
Board thickness: 2.4mm
Surface : ENIG
Inner layer:0.5&1oz
Outer layer:1oz
Material：FR4 EM898K Tg:180
Specialty: 24L，impedance control,back-drilling,press-fit holes.¥ 0.00立即购买
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12L Blue 5-Steps HDI ENIG IT-180A
Outer layer Cu:1oz
Inner layer Cu:1oz
Min track/gap 2.3mil/3mil
Min hole: 0.15mm
Board thickness: 1.2mm
Surface : ENIG
Material：FR4 IT-180A Tg:180
Specialty: 5-Steps HDI,Impedance Control
Laser Blind Hole:1-2,2-3,3-4,4-5,5-6,7-8,8-9,9-10,10-11,11-12.¥ 0.00立即购买
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8L Blue 3-Steps HDI ENIG
8L Blue 3-Steps HDI ENIG
Outer layer Cu:1oz
Inner layer Cu:1oz
Min track/gap 1.9mil/3mil
Min hole: 0.1mm
Board thickness: 1.2mm
Surface : ENIG
Material：FR4 S1000-2M Tg:180
Specialty: 3-Steps HDI,Impedance Control
Laser Blind Hole:1-2,2-3,3-4,5-6,7-8¥ 0.00立即购买
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8L 2-Steps Interconnected blind hole and burial hole Edge-plating ENIG
8L 2-Steps Interconnected blind hole and burial hole Edge-plating ENIG
Outer layer Cu:1oz
Inner layer Cu:1oz
Min track gap:3.5/3.5mil
Min hole: 0.1mm
Board thickness 1.05mm
Surface ENIG
Solder mask color:Green
Silkscreen:White
Material：FR4 S1000-2M Tg180
Specialty:2-Steps, Interconnected blind hole and burial hole,Impedance Control,Edge-plating.
Blind Hole1-2,1-3,6-8,7-8,6-7
Burial Hole:3-6¥ 0.00立即购买
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6-Layer 0[1].15mm Build And Buried Vias
¥ 0.00立即购买
